India's Semiconductor Journey as of 16 July 2026

India's Semiconductor Journey as of 16th July 2026

1. Semicon India 1.0 (Launched Dec 2021)

Outlay: ₹76,000 crore.
Objective: Establish structural foundations for core hardware manufacturing.
Progress: Successfully secured 12 approved manufacturing units with an investment pipeline of ₹1.64 lakh crore, alongside 24 backed startup design projects.

2. Semicon India 2.0 (Approved July 2026)
Outlay: ₹1,27,500 crore.
Objective: Expand fiscal support to early-stage input materials (silicon ingots, gases, and machinery) and promote indigenous Indian IP creation over generic outsourcing.

Ground Status of 12 manufacturing units approved under the India Semiconductor Mission :

Category A: Active Commercial Production (3 Plants Operational)

1. Micron Technology ATMP (Sanand, Gujarat): First packaging unit to start commercial operations (February 28, 2026).
2. Kaynes Semicon OSAT (Sanand, Gujarat): Second packaging plant to achieve active commercial output (March 31, 2026).
3. CG Power (CG Semi) OSAT (Sanand, Gujarat): Third specialized packaging unit to commence live commercial production (July 4, 2026).

Category B: Advanced Stage (Targeted Operationality by Dec 2026) :

4. Tata Electronics OSAT (Jagiroad, Assam): Mega advanced packaging infrastructure; fast-tracking construction to be structurally functional by late 2026.

5. Tata-PSMC Joint Venture Silicon Fab (Dholera, Gujarat): Commercial Silicon Chip Fab facility; target scheduled for its first operational silicon waves by December 2026.

Category C: Active Construction & Groundbreaking

6. India Chip (HCL–Foxconn JV) (Jewar, Uttar Pradesh): Packaging unit catering to downstream strategic electronics; currently undergoing active on-site construction.

7. Crystal Matrix Limited (CML) (Dholera, Gujarat): Integrated compound semiconductor and Mini/Micro-LED display facility; completed early-stage groundwork.

8. Suchi Semicon OSAT (Surat, Gujarat): Regional packaging facility approved in early mid-2026; presently in active foundation development.

9. Heterogenous Integration Packaging Solutions / 3DGS (Bhubaneswar, Odisha): Advanced 3D glass chip packaging unit; celebrated its structural groundbreaking in April 2026.

Category D: Engineering & Regulatory Pipeline :

10. SiCSem Private Limited (Odisha): Silicon Carbide compound fab targeting power electronics; in pre-construction phase after entering financial agreements.

11. ISMC Semiconductor Facility (Karnataka): Advanced analog semiconductor fabrication hub; in final land alignment and technical design scoping.

12. Advanced System Package Technologies / ASPT (Andhra Pradesh): Joint venture with South Korea’s APACK; working through final machinery procurement planning.

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